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Multilayer PCB Has More Than Two Conductive Copper Layers

Multilayer PCB has more than 2 conductive copper levels which mainly are made up of inner coating cores, prepreg levels and copper foils and they? re melted together by means of heat and stress. Lamination process is one of the key to handle good quality of multilayer PCB, this procedure requires specific heating and pressure regarding specific durations dependent on materials used to ensure the PCB board is produced properly.

The multilayer PCB is the development of the particular double sided PCB with increasing difficulty and density associated with components, they allowed the designers to be able to produce highly complicated and compact brake lines and further advancement of blind plus buried via gap technology has pushed these limits also further.

With typically the requirements of increased precision in various programs, the demands associated with multilayer PCB retain increasing continuously recently. The typical programs of multilayer printed circuit boards include Computers, Data storage, Cell phone transmission, GPS technology, satellite systems and so on.

A-TECH is an experienced multilayer PCB manufacturer which usually own complete multilayer PCB manufacturing process in house from inner layer, machine lamination to area finishes, it gives us more advantages in the competition of global industry shares for multilayer printed circuit panels on quality, value and lead time. multilayer pcb Currently the proportion of multilayer PCB we manufactured is more than 65%.

HDI PCB, the complete brand is High Density Interconnect PCB, it requires a lot higher wiring density with finer trace and spacing, smaller vias and increased connection pad thickness. Blind and buried vias? design is 1 of their marked feature. HDI PCB are widely applied for Cell phone, tablet computer, camera, GPS NAVIGATION, LCD module in addition to other different location.

A-TECH CIRCUITS provides HDI PCB production services to worldwide customers in the top quality automotive business, medical computer business, mobile, computing plus defense industry.

At present the advanced HDI technology we used include: “Direct Laserlight Drill”(DLD) is drilling of copper layer by direct CARBON DIOXIDE laser irradiation, beat additional laser drilling with conformal cover up, the copper immediate laser drilling is capable of providing higher accuracy, better hole quality and better efficiency for HDI projects. “Copper Filled” for special stack microvia, “Laser Immediate Imaging”(LDI) is particularly designed for great line technology, to eliminate dimensional balance problem of art work caused by ecological and material concerns.